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Product Details
DS-208
A rapid curing, general purpose epoxy adhesive/encapsulant. It forms a clear, hard, rigid bond or coating in minutes.
Features & Use
100% reactive, no solvents
Good dielectric strength
7 minute fixture time
Bonds metal, fabrics, ceramics, glass, wood and concrete (in combinations)
Cures fast for quick metal to metal bonding and repairs, Pots and encapsulates electronic components and assemblies, Seals against dust, dirt and combination, Fast curing, thin set, bonding above 5°C
Sizes
Technical Documents
Available in multiple sizes
Devcon® 5-Min Fast Dry Epoxy 28.4g
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